TSMC新工場ができても日本半導体の復活にはつながらない理由
確保できない半導体サプライチェーン
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図2 ソニーのCMOSイメージセンサ(CIS)
出所:Chih Hang Tung, TSMC, “3D Integration for More Moore and More than Moore”, VLSI 2019, Short Course.
出所:Chih Hang Tung, TSMC, “3D Integration for More Moore and More than Moore”, VLSI 2019, Short Course.
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